DocumentCode
2684719
Title
Finite element investigations of mechanical stress in metallization structures
Author
Weide, K. ; Yu, X. ; Menborn, F.
Author_Institution
Universitat Hannover
fYear
1996
fDate
1996
Firstpage
1703
Lastpage
1706
Keywords
Aluminum; Conducting materials; Current density; Finite element methods; Metallization; Plugs; Temperature; Thermal expansion; Thermal stresses; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888196
Filename
888196
Link To Document