Title :
A new method to determine the influence of thermomechanical stress on the reliability of metal lines in integrated circuits
Author :
Glasow, A.v. ; Kammer, H. ; Kohlhase, A.
Author_Institution :
SIEMENS AG, Semiconductor Group
Keywords :
Aluminum alloys; Capacitive sensors; Electromigration; Integrated circuit reliability; Temperature; Tensile stress; Testing; Thermal stresses; Thermomechanical processes; Tin;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888209
