Title :
Soldered joints on leaded components: development of a design tool to predict failure during temperature cycle tests
Author :
Wolbert, P.M.M. ; Brombacher, A.C.
Author_Institution :
Eindhoven University of Technology
Keywords :
Capacitive sensors; Creep; Lead; Manufacturing; Plastics; Predictive models; Stress; TV; Temperature dependence; Testing;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888217
