Soldered joints on leaded components: development of a design tool to predict failure during temperature cycle tests

Author

Wolbert, P.M.M. ; Brombacher, A.C.

Author_Institution

Eindhoven University of Technology

fYear

1996

fDate

1996

Firstpage

1791

Lastpage

1797

Keywords

Capacitive sensors; Creep; Lead; Manufacturing; Plastics; Predictive models; Stress; TV; Temperature dependence; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on

Print_ISBN

0-7803-3369-1

Type

DOI

10.1109/ESREF.1996.888217

Filename

888217

Link To Document