Title :
Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy
Author :
Lawton, W. ; Barrett, J.
Author_Institution :
University College
Keywords :
Acoustic devices; Assembly; Delamination; Electronic packaging thermal management; Electronics packaging; Flip chip; Inspection; Microelectronics; Optical microscopy; Thermal stresses;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888219
