DocumentCode :
2685318
Title :
Reliability indicators for lift-off of bond wires in IGBT power-modules
Author :
Farokhzad, B. ; TÜrkes, P. ; Wolfgang, E. ; Goser, K.
Author_Institution :
University of Dortmund
fYear :
1996
fDate :
1996
Firstpage :
1863
Lastpage :
1866
Keywords :
Bonding; Current measurement; Electrical resistance measurement; Insulated gate bipolar transistors; Semiconductor device measurement; Semiconductor device reliability; Stress; Testing; Voltage; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
Type :
conf
DOI :
10.1109/ESREF.1996.888233
Filename :
888233
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2685318
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