Title :
Proceedings, 2008 international conference on electronic packaging technology & high density packaging (ICEPT-HDP 2008)
Abstract :
The following topics are dealt with: electronic packaging technology; and high density packaging.
Keywords :
electronics packaging; electronic packaging technology; high density packaging;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606931
