DocumentCode
2685369
Title
Design of a test structure to evaluate electro-thermomigration in power ICs
Author
De Munari, I. ; Speroni, F. ; Reverberi, M. ; Neva, C. ; Lonz, L. ; Fantini, F.
Author_Institution
Univ. di Parmna
fYear
1996
fDate
1996
Firstpage
1875
Lastpage
1878
Keywords
Chemicals; Circuit testing; Current density; Electromigration; Heating; Integrated circuit reliability; Power integrated circuits; Silicon; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888236
Filename
888236
Link To Document