• DocumentCode
    2685377
  • Title

    Qualification for product development

  • Author

    Wang, Weiqiang ; Azarian, Michael H. ; Pecht, Michael

  • Author_Institution
    Center for Adv. Life Cycle Eng., Maryland Univ., College Park, MD
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    12
  • Abstract
    The aim of qualification is to verify whether a product meets or exceeds the reliability and quality requirements of its intended application. Qualification plays an important role in the process of product development. It can be classified by its specific purpose at different stages of the product development process. In this paper, a new methodology of product qualification is proposed based on physics-of-failure. This methodology consists of: product configuration and material information collection; application requirement information collection; strength limits and margins; failure modes, mechanisms and effects analysis; definition of qualification requirements; qualification test planning; testing; failure analysis and verification; and quality and reliability assessment. This approach to qualification ensures that it successfully addresses the failure mechanisms applicable to the productpsilas specific design, manufacture, and application conditions.
  • Keywords
    failure analysis; product design; product development; quality control; semiconductor device manufacture; semiconductor device reliability; failure analysis; material information collection; physics-of-failure; product configuration; product design; product development process; product qualification methodology; qualification test planning; quality assessment; reliability assessment; semiconductor devices; Failure analysis; Feedback; Manufacturing processes; Materials testing; Process design; Product design; Product development; Qualifications; Quality assurance; Reliability engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4606933
  • Filename
    4606933