Title :
Qualification for product development
Author :
Wang, Weiqiang ; Azarian, Michael H. ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng., Maryland Univ., College Park, MD
Abstract :
The aim of qualification is to verify whether a product meets or exceeds the reliability and quality requirements of its intended application. Qualification plays an important role in the process of product development. It can be classified by its specific purpose at different stages of the product development process. In this paper, a new methodology of product qualification is proposed based on physics-of-failure. This methodology consists of: product configuration and material information collection; application requirement information collection; strength limits and margins; failure modes, mechanisms and effects analysis; definition of qualification requirements; qualification test planning; testing; failure analysis and verification; and quality and reliability assessment. This approach to qualification ensures that it successfully addresses the failure mechanisms applicable to the productpsilas specific design, manufacture, and application conditions.
Keywords :
failure analysis; product design; product development; quality control; semiconductor device manufacture; semiconductor device reliability; failure analysis; material information collection; physics-of-failure; product configuration; product design; product development process; product qualification methodology; qualification test planning; quality assessment; reliability assessment; semiconductor devices; Failure analysis; Feedback; Manufacturing processes; Materials testing; Process design; Product design; Product development; Qualifications; Quality assurance; Reliability engineering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606933
