Title :
Ultrasonic bonding of polymer microfluidic chips
Author :
Zhang, Zong-bo ; Luo, Yi ; Wang, Xiao-dong ; Zhang, Zhen-qiang ; Wang, Li-ding
Author_Institution :
Non-traditional Machining of Minist. of Educ., Dalian Univ. of Technol. Precision, Dalian
Abstract :
Bonding is an essential step to enclose microchannels or microchambers in lab-on-a-chip. Ultrasonic bonding was studied as a deformation-free technique to realize high efficiency bonding of microfluidic chips. Based on viscoelastic dissipation theory, the main influential factors of heat generation rate during ultrasonic bonding was theoretically analyzed and numerically calculated using finite element method. According to the results, micro energy directors were designed to concentrate the ultrasonic power and to control the location of the joint. To demonstrate the performance of this bonding method, specially designed PMMA substrates of microfluidic chips were fabricated by means of hot embossing. With the ultrasonic bonding technique, the chips were reliably and hermetically bonded within less than a second.
Keywords :
embossing; finite element analysis; hermetic seals; lab-on-a-chip; microfluidics; ultrasonic bonding; viscoelasticity; PMMA substrates; deformation-free technique; finite element method; heat generation rate; hermetic bonding; hot embossing; lab-on-a-chip; micro energy directors; microchambers; microchannels; polymer microfluidic chips; ultrasonic bonding; viscoelastic dissipation theory; Bonding; Design methodology; Elasticity; Embossing; Finite element methods; Lab-on-a-chip; Microchannel; Microfluidics; Polymers; Viscosity; Ultrasonic bonding; finite element method; hot embossing; microfluidic chips;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606937
