Title :
New technologies for advanced high density 3D packaging by using TSV process
Author :
Kettner, Paul ; Kim, Bioh ; Pargfrieder, Stefan ; Zhu, Swen
Author_Institution :
EV Group, St. Florian
Abstract :
There is no question that 3D integration will be the next generation of packaging. This requires new technologies from ultra thin wafer handling to wafer to wafer bonding with 3D inter substrate connections. TSV is a process in which wafers are thinned, stacked and interconnected to significantly improve electrical performance such as signal transmission, interconnect density, reduced power consumption, form factor and manufacturing costs.
Keywords :
chip scale packaging; wafer bonding; wafer level packaging; TSV; form factor; high density 3D packaging; interconnect density; power consumption; signal transmission; ultra thin wafer handling; wafer bonding; CMOS technology; Cost function; Electronics packaging; Energy consumption; Integrated circuit packaging; Protection; Temperature; Thermal resistance; Through-silicon vias; Wafer bonding;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606939
