Title :
SiP/SoP technology and its implementation
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing
Abstract :
ldquoSystem-in-packagerdquo(SiP) and ldquosystem-on-packagerdquo (SoP) are different but similar in concepts. SiP and SoP definition were found in many open sources. SoP promises much more technologies and functions over SiP, leads to too many and more complicated research areas, and long time to develop, which could lost patience and interest from industry. Module-in-package(MiP) was proposed as a replacement of SoP for real implementations.
Keywords :
system-in-package; module-in-package; system-in-package; system-on-package; Assembly systems; Capacitors; Electronic components; Electronics packaging; Microelectronics; Micromechanical devices; Optical devices; Partial response channels; Radio frequency; Substrates; Module-in-Package; System-in-Package; System-on-Package;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606942
