DocumentCode
2685584
Title
In-situ monitoring of dry corrosion degradation of au ball bonds to al bond pads in plastic packages during HTSL
Author
Ragay, F.W. ; Pol, J.A.v.d. ; Naderman, J.
Author_Institution
Philips Semiconductors, Q&R Consumer IC Nijmegen
fYear
1996
fDate
1996
Firstpage
1931
Lastpage
1934
Keywords
Atherosclerosis; Bonding; Contact resistance; Corrosion; Degradation; Electrical resistance measurement; Gold; Monitoring; Plastic packaging; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888248
Filename
888248
Link To Document