Title :
In-situ monitoring of dry corrosion degradation of au ball bonds to al bond pads in plastic packages during HTSL
Author :
Ragay, F.W. ; Pol, J.A.v.d. ; Naderman, J.
Author_Institution :
Philips Semiconductors, Q&R Consumer IC Nijmegen
Keywords :
Atherosclerosis; Bonding; Contact resistance; Corrosion; Degradation; Electrical resistance measurement; Gold; Monitoring; Plastic packaging; Temperature;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888248
