Title :
Numerical simulation of the micro-channel heat sink on non-uniform heat source
Author :
Minliang, Zhang ; Xiaojing, Wang ; Hongjun, Liu ; Guoliang, Wang
Author_Institution :
Shanghai Univ., Shanghai
Abstract :
In this paper, the different heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the heat distributing and temperature rise of the MCHS with different channel width-dimensions. Uniform and non-uniform heat source are used to offer a constant heat flux, and the total heat flux amount is 270 W. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01 m/s to 10 m/s. The results show that tradition type MCHS will be under a low efficiency for cooling a non-uniform heat source. And the non-equal displacement of fins can effective decrease the temperature rise about 10% under the same cooling conditions cooling a non-uniform heat source. We also find that it is impossible to enhance the cooling effect through adding the flow rate if it has surpassed itpsilas limitation.
Keywords :
cooling; heat sinks; microchannel flow; numerical analysis; thermal management (packaging); MCHS cooler; MEMS system; channel width-dimensions; constant heat flux; heat source distributions; microchannel heat sink cooler; nonequal displacement; nonuniform heat source; numerical simulation; power 270 W; uniform heat source; Analytical models; Electronics cooling; Equations; Heat sinks; Heat transfer; Numerical simulation; Resistance heating; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606946