Heat transfer simulation of nanofluids in micro channel cooler

Author

Hongjun, Liu ; Xiaojing, Wang ; Minliang, Zhang ; Wen, Zhang ; Johan, Liu

Author_Institution

Shanghai Univ., Shanghai

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

5

Abstract

Since the pioneering work by Tuckerman & Pease, lots of publications about heat sink has been researched in the last decade. Many enhancements are proposed in order to increase the thermal conductivity of micro-channels including nanofluids, special shapes, and two phase flows. The nanofluid is a solid-liquid mixture which is composed of nanoparticles and a basic liquid. In this paper, the nanofluids with suspended multiwalled carbon nanotube and other metallic or nonmetallic particles are compared to enhance the heat transfer performance. The thermal resistance of the heat sink with nanofluids is simulated.

Keywords

VLSI; carbon nanotubes; flow simulation; heat sinks; heat transfer; microchannel flow; nanoparticles; thermal conductivity; thermal management (packaging); thermal resistance; two-phase flow; VLSI; heat sink; heat transfer simulation; metallic particles; microchannel cooler; nanofluids; nanoparticles; nonmetallic particles; solid-liquid mixture; suspended multiwalled carbon nanotube; thermal conductivity; thermal resistance; two phase flows; Carbon nanotubes; Equations; Heat sinks; Heat transfer; Nanoparticles; Resistance heating; Shape; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4606947

Filename

4606947