Title :
DPA tests on SiP device
Author :
Ling, Jin ; Jun, Hu ; Li, Han
Author_Institution :
Guangdong Yuejing High-Tech Co., Ltd., Guangzhou
Abstract :
The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.
Keywords :
integrated circuit reliability; system-in-package; C-SAM images; DPA tests; SiP device; multi-dice in package; Delamination; Electronic equipment testing; Failure analysis; Life testing; Materials testing; Packaging; Production; Resistors; Temperature; X-ray imaging;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606953
