3D Integration Using Self-Assembly at Air-Water-Solid Interface

Author

Kwang Soon Park ; Varel, Cagdac ; Ji Hao Hoo ; Baskaran, R. ; BoÌˆhringer, Karl F.

Author_Institution

Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA

Volume

23

Issue

3

fYear

2014

fDate

Jun-14

Firstpage

579

Lastpage

584

Abstract

This paper presents the first proof-of-concept 3D integration using fluidic self-assembly of chip-scale parts (2000 × 2000 ×100 μm³ ) at an air-water-solid interface. Four-layer 3D integration is achieved by assembling new parts over previously assembled parts. Assembly proceeds as an assembly substrate is pulled up through an air-water interface and electrical and mechanical bonding are achieved by solder reflow. Magnetic fields and temporary Faraday waves are introduced for one-to-one part-to-site registration in proper orientation. The alignment accuracy degrades with increasing number of layers due to weaker magnetic force. The maximum number of layers that can be achieved is simulated and analyzed. Via resistance including the effect of degradation of solder over repeated reflow process is measured.

Keywords

CMOS integrated circuits; fluidics; integrated circuit bonding; magnetic fields; reflow soldering; self-assembly; solders; three-dimensional integrated circuits; CMOS scaling approach; air-water-solid interface; assembly substrate; chip-scale parts; electrical bonding; fluidic self-assembly; four-layer 3D integration; magnetic fields; magnetic force; mechanical bonding; one-to-one part-to-site registration; repeated reflow process; solder reflow; temporary Faraday waves; via resistance; Assembly; Gold; Magnetic forces; Self-assembly; Substrates; Three-dimensional displays; Through-silicon vias; 3D integration; 3D packaging; Fluidic self-assembly; packaging; packaging.;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2013.2291235

Filename

6678204