• DocumentCode
    2685911
  • Title

    Synthesizing SPICE-compatible models of power delivery networks with resonance effect by time-domain waveforms

  • Author

    Wang, Chen-Chao ; Zhang, Shu-Qiang ; Cheng, Hung-Hsiang ; Lin, Tzu-Chih ; Chiu, Chi-Tsung ; Hung, Chih-Pin

  • Author_Institution
    Electr. Lab., Adv. Semicond. Eng. Inc., Kaohsiung
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel time-domain approach is proposed to synthesize the broadband equivalent circuit model of the power delivery network based on time-domain reflected (TDR)/transmitted (TDT) waveforms either through time-domain reflectometry measurement or finite-difference time-domain (FDTD) simulation. The step responses of the power delivery network are represented in terms of rational functions by the generalized pencil-of-matrix (GPOM) method. According to the step responses, the macro-pi model with each element represented by the optimum pole-residue forms is derived to model the power delivery networks. The equivalent circuits of the macro-pi model are synthesized by a systematic lumped-model extraction technique. The accuracy of this approach is demonstrated both in frequency- and time-domain.
  • Keywords
    SPICE; circuit CAD; equivalent circuits; finite difference time-domain analysis; power supply circuits; time-domain synthesis; SPICE-compatible models synthesis; broadband equivalent circuit model; digital circuits; finite-difference time-domain simulation; macro-pi model; pencil-of-matrix method; power delivery networks; resonance effect; time-domain reflected waveforms; time-domain reflectometry measurement; time-domain waveforms; transmitted waveforms; Circuit simulation; Circuit synthesis; Equivalent circuits; Finite difference methods; Network synthesis; Power measurement; Power system modeling; Reflectometry; Resonance; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4606964
  • Filename
    4606964