Title :
Thermal management and testing of MCM with embedded chip in silicon substrate
Author :
Geng, Fei ; Tang, Jia-jie ; Luo, Le
Author_Institution :
ShangHai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai
Abstract :
In this paper the thermal management and testing of MCM with embedded chip in Si substrate was performed. Regarding the interconnection structure of the module, a benzocyclobutene (BCB) film covers the multichip modules as dielectric layer and Au soldered balls are utilized for multi-layer vertical interconnection. The thermal resistance and junction temperature are simulated and tested respectively. The results show that the thermal resistance is between 0.7degC/W and 1degC/W dependent on the use of a additional heat sink and the optimization of the parameters.
Keywords :
heat sinks; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; monolithic integrated circuits; multichip modules; thermal management (packaging); thermal resistance; MCM testing; Si; benzocyclobutene film; dielectric layer; embedded chip; heat sink; junction temperature; multichip modules; multilayer vertical interconnection; silicon substrate; soldered balls; thermal management; thermal resistance; Dielectric substrates; Gold; Multichip modules; Performance evaluation; Resistance heating; Silicon; Temperature; Testing; Thermal management; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606966
