Dynamic bending tests and numerical simulation of board level electronic package

Author

Fei, Qin ; Yngve, Wang ; Bin, Liu ; Tong, An ; Ling, Jin

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.

Keywords

bending; circuit reliability; circuit simulation; electronics packaging; finite element analysis; printed circuit testing; solders; 4-point dynamic bending tests; PCB board; board level electronic package; digital image correlation method; finite element model; high-speed camera; package installation angel; peeling stress; solder joints; stiffness; Correlation; Digital cameras; Digital images; Electronic equipment testing; Electronics packaging; Finite element methods; Numerical simulation; Soldering; Stress; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4606969

Filename

4606969