Title :
A new method for the investigation of strip warpage of MAP-QFN
Author :
Gao, Guohua ; Wang, Honghui ; Yang, GuoJi ; Zhu, HaiQing
Author_Institution :
Nantong Fujitsu Microelectron. Co., Ltd., Nantong
Abstract :
Electronic package plays an important part in the development of IC industry. As we all known, strip warpage is a critical issue for the MAP-QFN manufacturing, results from the package structure, the thermal mismatch of materials and the manufacturing process. In this paper, a new finite element model was used to predict the warpage of one MAP-QFN block. And in this model, the temperature-dependent parameters of materials were characterized by DMA and DSC measurements, and the boundary condition was set up to be close to the real deforming situation. Furthermore, by the geometric triangle principle, the calculated warpage was also verified with the experiment measurement data. Finally we accomplished the optimization of related package parameters, and decreased the warpage of MAP-QFN by applying the dead weight on the strip block in the post mould curing process.
Keywords :
curing; differential scanning calorimetry; finite element analysis; integrated circuit manufacture; moulding; thermal management (packaging); DMA measurement; DSC measurement; IC industry; MAP-QFN manufacturing process; electronic package; finite element model; geometric triangle principle; post mould curing process; strip warpage; temperature-dependent parameters; thermal mismatch; Deformable models; Electronic packaging thermal management; Electronics industry; Finite element methods; Industrial electronics; Integrated circuit packaging; Manufacturing industries; Manufacturing processes; Predictive models; Strips;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606970
