Title :
On the interplay between the Engine Cooling Fan and Heat Exchanger for automotive AM band radiated emission measurement
Author :
Rostamzadeh, Cyrous ; Schwaiger, Dennis ; Maciejewski, David ; Williams, Kimball ; Steffka, Mark
Author_Institution :
Robert Bosch LLC, Plymouth, MI, USA
Abstract :
Electrical interaction of Engine Cooling Fan (ECF) with Heat Exchanger would strongly influence the electromagnetic behavior, and hence the EMC test results. Motivation and Objective for extensive and exhaustive component-level Electro-Magnetic Compliance (EMC) tests relies on close correlation and harmony between the vehicle-level and component-level test results. In fact, comprehensive component-level tests are presumed to indicate that most stringent possible vehicle-level Electro-Magnetic Interference (EMI) scenario is exercised in order to relieve expensive vehicle-level tests. This paper examines a component-level test scenario for an ECF according to OEM approved EMC test-plan mandating non-conductive air-flow load, thus resulting in AM band (0.53 MHz - 1.7 MHz) radiated emission deviations. Radiated Emissions (RE) deviations root-cause studies and troubleshooting indicates Amplitude Modulated (AM) band radiated emission compliance would result when a grounded metallic heat-exchanger is used.
Keywords :
amplitude modulation; automotive components; conformance testing; cooling; electromagnetic interference; engines; fans; heat exchangers; ECF; EMC test plan; EMI; OEM; RE deviation; amplitude modulated band; automotive AM band radiated emission measurement; component-level test; electrical interaction; electromagnetic behavior; electromagnetic compliance test; electromagnetic interference; engine cooling fan; frequency 0.53 MHz to 1.7 MHz; heat exchanger; vehicle-level test; Antenna measurements; Antennas; Automotive engineering; Cooling; Electromagnetic compatibility; Engines; Vehicles; Engine Cooling Fan (ECF); Radiated Emission (RE);
Conference_Titel :
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-1992-5
DOI :
10.1109/EMCSI.2015.7107679