DocumentCode
2686124
Title
A simplified thermal resistance network model for high power LED street lamp
Author
Luo, Xiaobing ; Xiong, Wei ; Liu, Sheng
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
7
Abstract
Light emitting diode (LED) street lamp heavily relies on successful thermal management, which strongly affects the optical extraction and the reliability/durability of the LED lamp. In this study, a thermal resistance network model was presented to estimate the maximum heat sink temperature of the street lamp, which could be utilized to further evaluate the thermal performance of the street lamp. Two high power LED street lamps, an 114 watts and an 80 watts LED street lamp were used to evaluate the present model. Their heat sink temperatures were calculated by the model, the results showed that the maximum heat sink temperature was about 61degC at the environment temperature of 25degC for the 114 watts LED street lamp. For the 80 watts LED street lamp, the maximum heat sink temperature was about 42.5degC at the environment temperature of 11degC. To prove the model feasibility, experimental investigations on the 114 watts and 80 watts LED street lamp were conducted. The results demonstrated that the heat sink temperature of the 114 watts LED street lamp remained to be stable at about 60degC after several hourspsila lighting at the room temperature of 25degC. The heat sink temperature of the 80 watts LED street lamp remained to be stable at about 42degC at the room temperature of 11degC. Comparing the results achieved by the thermal resistance model with the experimental results, it was found that the proposed thermal resistance model could be used for temperature estimation and thermal evaluation for the high power street lamp.
Keywords
LED lamps; thermal management (packaging); thermal resistance; heat sink temperatures; high power LED street lamp; light emitting diode street lamp; optical extraction; power 114 W; power 80 W; temperature 25 degC; thermal management; thermal resistance network model; Electronic packaging thermal management; Energy consumption; Engines; Heat sinks; LED lamps; Light emitting diodes; Resistance heating; Temperature; Thermal management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4606976
Filename
4606976
Link To Document