Frequency dielectric constant and loss tangent extracting of organic material using multi-length microstrip

Author

Wu, Sung-Mao ; Lai, Chi-Chang ; Cheng, Hung-Hsiang ; Tai, Yu-Che ; Wang, Chen-Chao

Author_Institution

Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

Organic material using for packaging substrate is selected and multi-length microstrip lines in same trace width are designed and performed on it. Novel formulas deliver to extract dielectric constant and loss tangent varying with frequency for selected organic materials will be shown in this paper. Performances of microstrip lines are measured by Agilent vector network analyzer up to 20 GHz and SOLT calibration used to get two-port S-parameters. Then, novel formulas are used to extract material parameters in ADS software by measurement date.

Keywords

S-parameters; calibration; electronics packaging; microstrip lines; permittivity; ADS software; Agilent Vector Network Analyzer; SOLT calibration; frequency 20 GHz; frequency dielectric constant; loss tangent extraction; multilength microstrip lines; organic material; packaging substrate; two-port S-parameters; Dielectric constant; Dielectric losses; Dielectric measurements; Dielectric substrates; Frequency; Microstrip; Organic materials; Packaging; Performance analysis; Performance evaluation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4606991

Filename

4606991