DocumentCode :
2686383
Title :
Fast structure-aware direct time-domain finite element solver for large-scale on-die power grid simulation
Author :
Woochan Lee ; Dan Jiao
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2015
fDate :
15-21 March 2015
Firstpage :
259
Lastpage :
264
Abstract :
A fast algorithm is developed for the analysis and design of very large-scale on-die power grids. The structure specialty of on-chip power grids such as Manhattan geometry and layered permittivity is preserved in the proposed algorithm, and the resulting disadvantage in time step is overcome. As a result, the large-scale matrix solution encountered in the 3-D power grid analysis is turned into a simple scaling of the solution of a small 1-D tridiagonal matrix, which can be obtained in linear (optimal) complexity with negligible cost. Meanwhile, the time step size is not sacrificed, and the total number of time steps to be simulated is also significantly reduced, thus achieving a total cost reduction in CPU time. Applications to the simulation of very large-scale on-chip power grids on a single core have demonstrated the superior performance of the proposed method.
Keywords :
finite element analysis; integrated circuit design; integrated circuit interconnections; 1D tridiagonal matrix; 3D power grid analysis; Manhattan geometry; direct time-domain finite element solver; fast algorithm; fast structure aware; large scale matrix solution; large scale power grid; large-scale on-chip power grids; layered permittivity; linear optimal complexity; on-die power grid simulation; Accuracy; Conductivity; Eigenvalues and eigenfunctions; Permittivity; Power grids; System-on-chip; Time-domain analysis; DC Analysis; Fast Solvers; On-Chip Circuits; On-Die Power Grids; Time-Domain Finite Element Method; Transient Analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-1992-5
Type :
conf
DOI :
10.1109/EMCSI.2015.7107696
Filename :
7107696
Link To Document :
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