• DocumentCode
    2686383
  • Title

    Fast structure-aware direct time-domain finite element solver for large-scale on-die power grid simulation

  • Author

    Woochan Lee ; Dan Jiao

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2015
  • fDate
    15-21 March 2015
  • Firstpage
    259
  • Lastpage
    264
  • Abstract
    A fast algorithm is developed for the analysis and design of very large-scale on-die power grids. The structure specialty of on-chip power grids such as Manhattan geometry and layered permittivity is preserved in the proposed algorithm, and the resulting disadvantage in time step is overcome. As a result, the large-scale matrix solution encountered in the 3-D power grid analysis is turned into a simple scaling of the solution of a small 1-D tridiagonal matrix, which can be obtained in linear (optimal) complexity with negligible cost. Meanwhile, the time step size is not sacrificed, and the total number of time steps to be simulated is also significantly reduced, thus achieving a total cost reduction in CPU time. Applications to the simulation of very large-scale on-chip power grids on a single core have demonstrated the superior performance of the proposed method.
  • Keywords
    finite element analysis; integrated circuit design; integrated circuit interconnections; 1D tridiagonal matrix; 3D power grid analysis; Manhattan geometry; direct time-domain finite element solver; fast algorithm; fast structure aware; large scale matrix solution; large scale power grid; large-scale on-chip power grids; layered permittivity; linear optimal complexity; on-die power grid simulation; Accuracy; Conductivity; Eigenvalues and eigenfunctions; Permittivity; Power grids; System-on-chip; Time-domain analysis; DC Analysis; Fast Solvers; On-Chip Circuits; On-Die Power Grids; Time-Domain Finite Element Method; Transient Analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-1992-5
  • Type

    conf

  • DOI
    10.1109/EMCSI.2015.7107696
  • Filename
    7107696