DocumentCode
2686440
Title
Impulse response generation from S-parameters for power delivery network simulation
Author
Ilgweon Kang ; Xinan Wang ; Jeng-Hau Lin ; Coutts, Ryan ; Chung-kuan Cheng
Author_Institution
CSE Dept., UC San Diego, La Jolla, CA, USA
fYear
2015
fDate
15-21 March 2015
Firstpage
277
Lastpage
282
Abstract
Accurate analysis of power delivery network is indispensable to assess VLSI package and interconnection network. Given the S-parameters that characterize the linear packaging system, we derive the transient response of power delivery networks. We utilize the compressed sensing technique to generate the impulse response that fits the S-parameters with sparsity. Our method shows accurate, concise, and stable results.
Keywords
S-parameters; VLSI; integrated circuit interconnections; integrated circuit packaging; power electronics; transient response; S-parameters; VLSI package; compressed sensing; impulse response generation; interconnection network; linear packaging system; power delivery network simulation; transient response; Compressed sensing; Delays; Fourier transforms; Frequency-domain analysis; Matching pursuit algorithms; Scattering parameters; Time-domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-1992-5
Type
conf
DOI
10.1109/EMCSI.2015.7107699
Filename
7107699
Link To Document