Title :
Molding compounds characteristics testing of plastic device used in high reliability fields
Author_Institution :
China Electron. Standardization Inst., Beijing, China
Abstract :
In recent years, with the plastic device materials and process progresses, the plastic device reliability has been improved. In this paper, the relationship between the characteristics of molding compounds and device reliability has been researched.
Keywords :
integrated circuit packaging; materials testing; moulding; plastic packaging; reliability; high reliability fields; molding compound characteristic testing; plastic device materials; plastic device reliability; process progress; Absorption; Compounds; Corrosion; Moisture; Plastics; Reliability; Testing; ion content; moisture absorption; molding compound; reliability;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on
Conference_Location :
Guiyang
Print_ISBN :
978-1-61284-667-5
DOI :
10.1109/ICRMS.2011.5979490
