• DocumentCode
    2686933
  • Title

    A CMOS relative ultrasound energy measurement circuit with temperature compensation

  • Author

    Lu, Chengbin ; Postula, Adam

  • Author_Institution
    Sch. of Inf. Technol. & Electr. Eng., Univ. of Queensland, Brisbane, QLD, Australia
  • fYear
    2010
  • fDate
    3-6 May 2010
  • Firstpage
    1274
  • Lastpage
    1277
  • Abstract
    A CMOS temperature compensated circuit used in measuring relative ultrasound energy is presented in this paper. The core of the circuit is a temperature compensated voltage to current squarer (VCSQ) and a current integrator. The VCSQ consists of a Linear-Transconductor(LTC) and a current-mode squarer. A current source (dependent on MOS transconductance which is in turn dependent on absolute temperature) is used to bias the current-mode squarer; this provides temperature compensation of the circuit. The circuit is simulated for AMI05 (0.5um) technology using Eldo in Mentor Graphics environment. With the compensation, the VCSQ output drift with temperature is achieved better than 1.98% in the 10~90°C range for ±1.2V input range. The integrator output drift is achieved for full scale error better than 2.5% in the 10-90°C range, 1.6% in the 30~90°C range.
  • Keywords
    CMOS integrated circuits; current-mode circuits; function generators; integrating circuits; operational amplifiers; signal processing equipment; ultrasonic measurement; AMI05 technology; CMOS relative ultrasound energy measurement circuit; current integrator; current mode squarer; current source; linear transconductor; temperature compensation; voltage-to-current squarer; Circuit simulation; Energy measurement; Graphics; Integrated circuit measurements; Temperature dependence; Temperature measurement; Transconductance; Ultrasonic imaging; Ultrasonic variables measurement; Voltage; CMOS; squarer; temperature compensation; ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2010 IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-2832-8
  • Electronic_ISBN
    1091-5281
  • Type

    conf

  • DOI
    10.1109/IMTC.2010.5488074
  • Filename
    5488074