DocumentCode
2686969
Title
Simulation on thermal characteristics of LED chips for design optimization
Author
Cheng, Ting ; Luo, Xiaobing ; Huang, Suyi ; Gan, Zhiyin ; Liu, Sheng
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol, Wuhan
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
4
Abstract
As thermal performance is importance for high-power LED devices, there exists a need to build a validated model to clarify the thermal transfer mechanisms in the LED chip in terms of the chip materials and structures. High-power LED was numerically investigated using the finite element method. A series of substrate materials with different thermal conductivity and thicknesses were studied. The impact of varying cooling capacities on chip junction temperature is also presented.
Keywords
finite element analysis; light emitting diodes; thermal conductivity; LED chips; design optimization; different thermal conductivity; finite element method; thermal characteristics; Conducting materials; Design optimization; Heat transfer; Light emitting diodes; Liquid crystal displays; Packaging; Temperature; Thermal conductivity; Thermal engineering; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607030
Filename
4607030
Link To Document