Title :
A review of semiconductor packaging and its role in electronics manufacturing
Author_Institution :
CAMMAX Machines Ltd., Cambridge, UK
Abstract :
The features of semiconductor packaging are examined, covering mounting, connections, and protection. The forms of semiconductor dice and the packaging options are discussed. These comprise devices from standard diffusion processing, including direct die mounting on to substrates, SO/SOT devices, and chip carriers; devices having added wafer processing, namely, flip chips, beam leads, and tape automated bonding: and the pin grid array.<>
Keywords :
VLSI; hybrid integrated circuits; packaging; reviews; surface mount technology; PGA; SO devices; SOT devices; TAB; added wafer processing; beam leads; chip carriers; connections; direct die mounting; electronics manufacturing; flip chips; forms of semiconductor dice; mounting; packaging options; pin grid array; protection; review; semiconductor packaging; standard diffusion processing; tape automated bonding; Assembly; Electronics packaging; Gold; Large scale integration; Lead; Plastic packaging; Semiconductor device manufacture; Semiconductor device packaging; Silicon; Very large scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171045
