Title :
Board level assembly of inertial MEMS devices based on surface mounting technology
Author :
Li, Kejia ; Sun, Young ; Liao, Hongguang ; Jin, Yufeng
Author_Institution :
Grad. Sch., Peking Univ., Beijing
Abstract :
In this paper, the board level assembly of inertial MEMS devices using surface mounting technology (SMT) in mass production has been studied. MEMS microphone is taken as a representative device. Meanwhile, assembly precision and strength are also analyzed in the experiments. A further analyze in assembly strength has been done using theoretical simulation. The result indicates the full compatibility of MEMS devices with SMT. Design principles of the application of inertial MEMS devices in SMT has also been discussed.
Keywords :
mass production; micromechanical devices; microphones; surface mount technology; MEMS microphone; board level assembly; inertial MEMS devices; mass production; surface mounting technology; theoretical simulation; Assembly; Electronic packaging thermal management; Electronics packaging; Mass production; Microelectromechanical devices; Micromechanical devices; Microphones; Surface-mount technology; Thermal force; Thermal stresses; Surface Mounting Technology; assembly precision; assembly strength; board level assembly; inertial MEMS devices;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607040
