Board level assembly of inertial MEMS devices based on surface mounting technology

Author

Li, Kejia ; Sun, Young ; Liao, Hongguang ; Jin, Yufeng

Author_Institution

Grad. Sch., Peking Univ., Beijing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

In this paper, the board level assembly of inertial MEMS devices using surface mounting technology (SMT) in mass production has been studied. MEMS microphone is taken as a representative device. Meanwhile, assembly precision and strength are also analyzed in the experiments. A further analyze in assembly strength has been done using theoretical simulation. The result indicates the full compatibility of MEMS devices with SMT. Design principles of the application of inertial MEMS devices in SMT has also been discussed.

Keywords

mass production; micromechanical devices; microphones; surface mount technology; MEMS microphone; board level assembly; inertial MEMS devices; mass production; surface mounting technology; theoretical simulation; Assembly; Electronic packaging thermal management; Electronics packaging; Mass production; Microelectromechanical devices; Micromechanical devices; Microphones; Surface-mount technology; Thermal force; Thermal stresses; Surface Mounting Technology; assembly precision; assembly strength; board level assembly; inertial MEMS devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607040

Filename

4607040