A reliability investigation of MEMS transducers with comb structures

Author

An, Ping ; He, Yandong ; Jin, Yufeng ; Hao, Yilong

Author_Institution

Inst. of Microelectron., Peking Univ., Beijing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

6

Abstract

An overview of reliability investigation of micro electro mechanical system (MEMS) transducers with comb structures was presented. With the development of the MEMS industrialization, the reliability is underway to meet the need of market. To build a reliability research and develop platform, MEMS center of Peking University made its roadmap of a general developing plan. In this paper, the roadmap was presented and the short-term roadmap about failure analysis (FA) was illustrated. In addition, FA techniques of localization, characterization and sample preparation for MEMS were summarized. Finally, some FA cases of the center of PKU were discussed and a destructive physical analysis (DPA) case about the particle impact noise detection (PIND) was presented.

Keywords

failure analysis; micromechanical devices; reliability; transducers; MEMS transducers; comb structures; electromechanical system; failure analysis; particle impact noise detection; reliability; Actuators; Consumer electronics; Costs; Failure analysis; Integrated circuit reliability; Laboratories; Microelectromechanical devices; Micromechanical devices; Stress; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607044

Filename

4607044