Title :
Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints
Author :
Shihua Yang ; Chunqing Wang ; Yanhong Tian ; Pengrong Lin ; Liang, Le
Author_Institution :
Dept. of Electron. Packaging Sci. & Eng., Harbin Inst. of Technol., Harbin
Abstract :
As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less influence on the growth of beta-Sn grains.
Keywords :
ageing; copper alloys; grain size; silver alloys; solders; tin alloys; Sn-Ag-Cu; beta-Sn grain number; solder joint size; solder joints; thermal aging; Aging; Aluminum alloys; Anisotropic magnetoresistance; Copper alloys; Electronics packaging; Materials science and technology; Optical polarization; Soldering; Temperature; Tin;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607056
