Title :
Dynamic behavior tests of lead-free solders at high strain rates by the SHPB technique
Author :
Fei, Qin ; Tong, An ; Na, Chen
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing
Abstract :
Dynamic behavior of solder joints in microelectronic packages is key issue for drop/impact reliability design of mobile electronic products. The dynamic mechanical behaviors of 63Sn37Pb, 96.5Sn3.5Ag and 96.5Sn3.0Ag0.5Cu solder alloys at high strain rate were investigated by using the split Hopkinson pressure/tension bar testing technique. Stress-strain curves of the three materials were obtained at strain rate 600 s-1, 1200 s-1 and 2200 s-1, respectively. The experimental results show that all the three materials are strongly strain rate dependent. Among them 96.5Sn3.5Ag is the most sensitive to strain rate, while 96.5Sn3.0Ag0.5Cu has the greatest yield stress and tensile strength. Relations of the tensile strength, fracture strain and yield stress of the materials with strain rate were proposed by fitting the experimental data.
Keywords :
copper alloys; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; silver alloys; solders; tin alloys; SHPB technique; SnAg; SnAgCu; SnPb; drop reliability design; dynamic behavior tests; impact reliability design; lead-free solders; microelectronic packages; mobile electronic products; solder alloys; solder joints; split Hopkinson pressure technique; stress-strain curves; tension bar testing technique; Capacitive sensors; Compressive stress; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Materials testing; Mechanical factors; Soldering; Tensile strain; Tensile stress;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607060
