DocumentCode :
2687524
Title :
Environmentally friendly electronics for high reliability
Author :
McElroy, J.B., Sr. ; Pfahl, R.C., Jr.
Author_Institution :
Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA
fYear :
2008
fDate :
28-31 July 2008
Firstpage :
1
Lastpage :
3
Abstract :
In 2006 when the European Unionpsilas RoHS Regulation went into effect, a number of global firms who produce high-reliability products such as servers and telecommunication equipment had decided to take the exemption allowed for Pb containing solders in these applications. As a result they had not completed the tests necessary to prove the reliability of Tin Silver Copper (SAC) alloys in these applications. In 2007 it became apparent to many of these firms that they could no longer procure components with traditional SnPb surface finishes, and thus they faced an unknown reliability risk. In 2006 iNEMI had begun a study to evaluate the reliability of ldquoPb-Free BGAs in SnPb Assemblies.rdquo This paper will report on the results of this initial study and will then report on several studies currently under way to evaluate the reliability of new green-materials in high-reliability applications.
Keywords :
RoHS compliance; ball grid arrays; electronics industry; reliability; RoHS regulation exemption; SnPb; environmentally friendly electronics; green-material; high reliability electronics; lead free BGA; reliability risk; Assembly; Consumer electronics; Copper alloys; Electronic equipment manufacture; Mission critical systems; Robustness; Silver; Supply chains; Surface finishing; Tin alloys;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
Type :
conf
DOI :
10.1109/ICEPT.2008.4607068
Filename :
4607068
Link To Document :
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