Microstructural and physical characteristics of Sn-Ag-Cu-Mg lead-free solders

Author

Lu, Sheng ; Luo, Fei ; Chen, Jing ; Wang, Baohua

Author_Institution

Dept. of Welding & Mater. Forming, Jiangsu Univ. of Sci. & Technol., Zhenjiang

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

Sn-Ag-Cu-Mg lead-free solders based on a eutectic Sn-Ag-Cu alloy were prepared by means of orthogonal experimental design. The melting temperature and the wettability of Sn-Ag-Cu-Mg solders were tested by differential thermal analysis (DTA) method and SAT solder checker respectively. Combined with the microstructure analysis, the influence of trace addition of Mg on the melting points and wettability was investigated. The results indicate that Mg, combined with the other alloying elements Ag and Cu, plays a key role in modifying the melting characteristics of the alloy solders. And with the added Mg, the wettability of solders is depressed.

Keywords

copper alloys; magnesium alloys; melting; silver alloys; soldering; thermal analysis; tin alloys; wetting; Sn-Ag-Cu-Mg; differential thermal analysis; lead-free solder; melting temperature; microstructural characteristic; microstructure analysis; orthogonal experiment; physical characteristic; solder wettability; Copper alloys; Design for experiments; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Mechanical engineering; Microstructure; Temperature; Welding; Sn-Ag-Cu-Mg; lead-free solders; melting temperature; microstructure; wettability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607071

Filename

4607071