Title :
Microstructural and physical characteristics of Sn-Ag-Cu-Mg lead-free solders
Author :
Lu, Sheng ; Luo, Fei ; Chen, Jing ; Wang, Baohua
Author_Institution :
Dept. of Welding & Mater. Forming, Jiangsu Univ. of Sci. & Technol., Zhenjiang
Abstract :
Sn-Ag-Cu-Mg lead-free solders based on a eutectic Sn-Ag-Cu alloy were prepared by means of orthogonal experimental design. The melting temperature and the wettability of Sn-Ag-Cu-Mg solders were tested by differential thermal analysis (DTA) method and SAT solder checker respectively. Combined with the microstructure analysis, the influence of trace addition of Mg on the melting points and wettability was investigated. The results indicate that Mg, combined with the other alloying elements Ag and Cu, plays a key role in modifying the melting characteristics of the alloy solders. And with the added Mg, the wettability of solders is depressed.
Keywords :
copper alloys; magnesium alloys; melting; silver alloys; soldering; thermal analysis; tin alloys; wetting; Sn-Ag-Cu-Mg; differential thermal analysis; lead-free solder; melting temperature; microstructural characteristic; microstructure analysis; orthogonal experiment; physical characteristic; solder wettability; Copper alloys; Design for experiments; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Mechanical engineering; Microstructure; Temperature; Welding; Sn-Ag-Cu-Mg; lead-free solders; melting temperature; microstructure; wettability;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607071
