Electrical modelling of high frequency microelectronic package structures

Author

Ng, M.W.R. ; Seager, R.D.

Author_Institution

Dept. of ELectron. & Electr. Eng., Loughborough Univ. of Technol., UK

fYear

1990

fDate

0-0 1990

Firstpage

244

Lastpage

253

Abstract

The electrical characteristics of a prototype high-frequency integrated circuit package are evaluated by the finite-difference time-domain method. This method gives a fast numerical solution to Maxwell´s equations in space and time. The electrical characteristics evaluated are impedance, crosstalk, transmission loss, and reflection coefficient. They are used to provide circuit models for the package structures. Modeling of the air/dielectric interface has been successfully achieved.<>

Keywords

VLSI; circuit analysis computing; crosstalk; electric impedance; packaging; Maxwell´s equations; air/dielectric interface; circuit models; crosstalk; electrical characteristics; electrical modelling; finite-difference time-domain method; high frequency microelectronic package structures; impedance; numerical solution; package structures; prototype; reflection coefficient; transmission loss; Crosstalk; Electric variables; Finite difference methods; Frequency; Impedance; Integrated circuit packaging; Maxwell equations; Microelectronics; Prototypes; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171048

Filename

171048