DocumentCode :
2687707
Title :
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
fYear :
1998
fDate :
10-10 Dec. 1998
Abstract :
The following topics were dealt with. Thermomechanical modelling; stress analysis; electrical modelling; cooling; process technology; thermal simulation; reliability; and materials
Keywords :
cooling; modelling; packaging; reliability; simulation; stress analysis; cooling; electrical modelling; materials; process technology; reliability; stress analysis; thermal simulation; thermomechanical modelling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Conference_Location :
Singapore
Print_ISBN :
0-7803-5141-X
Type :
conf
DOI :
10.1109/EPTC.1998.755966
Filename :
755966
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2687707
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