Design of testing chip for measuring mechanical properties of thin films

Author

Liu, Rui ; Wang, Hong ; Li, Xueping ; Tang, Jun ; Mao, Shengping ; Ding, Guifu

Author_Institution

Res. Inst. of Micro /Nano Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.

Keywords

deformation; elongation; integrated circuit design; integrated circuit testing; tensile testing; test equipment; thin films; ultraviolet lithography; deformation; elongation; testing chip design; thin film specimens; ultraviolet lithographic GalVanoformung Abformung technology; uniaxial tensile test; Force measurement; Mechanical factors; Mechanical variables measurement; Semiconductor device measurement; Strain measurement; Stress measurement; Tensile strain; Testing; Transistors; Uniaxial strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607079

Filename

4607079