Abstract :
Summary form only given. The electronics industry is a young and dynamic industry, of which the main driver is miniaturisation. The analogue products of the seventies and the digital products of the eighties have turned into the personal communication products of the nineties. Examples include mobile phones, palmtop computers and pagers. Production volumes and product functionality and diversity are increasing rapidly. This paper gives an overview of the latest trends, shifts and challenges in the electronic assembly processes. An overview is given of new package types and associated mounting technologies. Emerging package types are fine-pitch ICs (with pitches ⩾0.3 mm), exotic packages, miniBGAs, chip scale packages (μBGAs) and bare dies. The possibility of integrating the mounting of CSPs and flip-chips in standard miniaturised reflow processes is discussed. The impact of these new package types on equipment requirements and printed board technology is analysed. For printed boards, the trend is towards smaller line widths and spacings, smaller interconnections (microvias), double-sided multilayers, flex and more accurate solder-resist positioning
Keywords :
assembling; ball grid arrays; chip scale packaging; consumer electronics; flip-chip devices; integrated circuit interconnections; position control; printed circuits; reflow soldering; resists; reviews; technological forecasting; 0.3 mm; CSP mounting; IC pitch; analogue products; assembly processes; bare dies; chip scale packages; digital products; double-sided multilayers; electronic assembly processes; electronics industry; equipment requirements; fine-pitch ICs; flex circuits; flip-chip mounting; interconnections; line spacing; line width; microBGAs; microvias; miniBGAs; miniaturisation; miniaturised consumer electronics; miniaturised reflow processes; mobile phones; mounting technologies; package types; pagers; palmtop computers; personal communication products; printed board technology; product diversity; product functionality; production volumes; solder-resist positioning; Assembly; Chip scale packaging; Consumer electronics; Driver circuits; Electronics industry; Electronics packaging; Mobile handsets; Packaging machines; Personal digital assistants; Production;
