Title :
Cu out-diffusion kinetics in pre-plated Cu-alloy leadframes investigated by a developed EDX-based oxidation test
Author :
Liu, Lilin ; Fu, Ran ; Liu, Deming ; Zhang, Tong-Yi
Author_Institution :
Sch. of Phys. & Eng., Sun Yat-Sen Univ., Guangzhou
Abstract :
The energy dispersive X-ray (EDX)-based permeation and oxidation test has been further developed by a novel theoretical analysis, in which the gradient of chemical potential rather than the concentration gradient is employed. The EDX-based permeation and oxidation tests determine Cu flux coefficients in the CuO oxide layers to be 4.17times10-26 molldr(mldrsldrkJ/mol)-1exp(-70.30 kJldrmol-1/RT) in temperature range of 250 degC - 400 degC. And the Cu flux coefficients in the Ni layers are 1.72times10-32 molldr(mldrsldrkJ/mol)-1 and 5.92times10-32 molldr(mldrsldrkJ/mol)-1 at temperatures of 250 degC and 300 degC, respectively.
Keywords :
X-ray chemical analysis; copper; diffusion; electronics packaging; oxidation; Cu; chemical potential gradient; concentration gradient; energy dispersive X-ray; flux coefficients; out-diffusion kinetics; oxidation; permeation; pre-plated Cu-alloy leadframes; temperature 250 degC to 400 degC; Annealing; Gold; Kinetic theory; Lead; Oxidation; Surface resistance; Temperature; Testing; Thickness measurement; Tin;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607081