Title :
Design of high speed formed printed circuit for use on board satellite
Author_Institution :
Laben SpA, Vimodrone, Italy
Abstract :
Design criteria for high-speed boards are examined, and materials selection for high-speed boards with high performance and reliability is shown. Other issues discussed are the design and development of multilayer printed circuit boards (PCBs) for high-speed component interconnection behavior analysis, the effects of working tolerances on the characteristic impedance of the traces, and the qualification of PCBs to be used on board satellites.<>
Keywords :
aerospace instrumentation; artificial satellites; printed circuit design; quality control; strip lines; MLBs; PCBs; characteristic impedance; design criteria; high performance; high speed formed printed circuit; high-speed boards; high-speed component interconnection behavior analysis; materials selection; multilayer boards; multilayer printed circuit boards; qualification; reliability; satellites; working tolerances; Electromagnetic fields; Frequency; Integrated circuit interconnections; Microstrip; Nonhomogeneous media; Printed circuits; Propagation delay; Satellites; Stripline; Transmission lines;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171049
