The mini flex ball-grid-array chip-scale package

Author

Ang, Simon ; Meyer, David ; Thach, Tenyu ; Schaper, Len ; Brown, William D.

Author_Institution

Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA

fYear

1998

fDate

8-10 Dec 1998

Firstpage

13

Lastpage

17

Abstract

The reliability of the mini-flex ball grid array chip scale package (mF-BGA CSP) was investigated. Thermal shock testing on these packages revealed that both the underfill and test board metallization play a significant role in reliability. A time-domain reflectometry method was used to detect which interface failure caused the mF-BGA CSP to fail. The predominant failure was determined to be at the solder ball/PCB interface

Keywords

ball grid arrays; chip scale packaging; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; metallisation; soldering; thermal shock; time-domain reflectometry; interface failure; mF-BGA CSP; mini flex ball-grid-array chip-scale package; mini-flex BGA CSP; predominant failure; reliability; solder ball/PCB interface failure; test board metallization; thermal shock testing; time-domain reflectometry; underfill; Assembly; Chip scale packaging; Electric shock; Electronic packaging thermal management; Electronics packaging; Metallization; Printed circuits; Semiconductor device measurement; Space technology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.755972

Filename

755972