The synthesis and curing kinetics of the silicon-containing epoxy resin with environmentally friendship flame retardance

Author

Ming-Shan Yang ; Jie He ; Lin-Kai Li ; Zhen Liu

Author_Institution

Dept. of Mater. Sci. & Eng., Beijing Inst. of Petrochem. Technol., Beijing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

3

Abstract

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl₂ as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by ¹H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the -Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which offers basic data for the application of CNE-Si in large-scale circuit packaging.

Keywords

Fourier transform spectra; chemical structure; curing; differential scanning calorimetry; infrared spectra; integrated circuit packaging; nuclear magnetic resonance; polymer structure; polymers; thermal stability; FTIR spectra; Kissinger method; NMR; Ozawa method; TGA; activation energy; chemical structure; curing kinetics; diphenylsilandiol; epoxy resin; flame retardance; nonisothermal DSC; ortho-cresol novolac; thermal stability; Chemicals; Circuits; Curing; Epoxy resins; Fires; Kinetic theory; Large-scale systems; Stability analysis; Temperature; Thermal stability; Silicon-containing epoxy resin; curing kinetics; synthesis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607083

Filename

4607083