Title :
The influence of pre-heat treatment on peeling resistance of oxide film of copper alloy lead frames
Author :
Mao, Jiwang ; Chen, Xi ; Hu, Anmin ; Li, Ming ; Mao, Dali
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai
Abstract :
The peeling resistances of oxide film formed on copper alloy lead frames with and without pre-heat treatment were investigated. With the increase of the heat treatment temperature, the peeling resistances of oxide film of C194 decrease, while C7025 show little variances in contrast. Crystal orientation of copper alloy with and without heat treatment was examined by XRD. Compared with peeling test results, it is proved that the surface crystalline orientation of cooper alloy has crucial impact on the cohesive strength between the oxide film and copper substrate. When the surface follow (111) close-packed face, the oxide film forms with better peeling resistance property, otherwise the peeling resistance will deteriorate. Furthermore, peeling resistance of oxide film has correlation with the precipitated phase.
Keywords :
X-ray diffraction; copper alloys; crystal orientation; heat treatment; precipitation; CuJkJk; XRD; cohesive strength; crystal orientation; peeling resistance; pre-heat treatment; precipitated phase; surface crystalline orientation; Copper alloys; Crystallization; Heat treatment; Lead compounds; Resistance heating; Surface resistance; Surface treatment; Temperature; Testing; X-ray scattering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607088
