The thermal and electric conduction properties of high dense TiB2P/Cu composites fabricated by squeeze casting technology

For electronic packaging applications, TiB₂/Cu composites with volume fractions of 50%, 58%, 65% TiB₂ content have been fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the TiB₂/Cu composites are investigated. The results show that TiB₂ particles are homogeneous and uniformly, and the TiB₂-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers; The densifications of the TiB₂/Cu composites are higher than 98.2%. The thermal conductivities of TiB_2P/Cu composites range from 167.3 to 215.4 W/m degC and decrease with an increase in volume fraction of TiB₂ content. The thermal conductivities agree well with predicted values of theoretical models. The electric conductivities of TiB₂/Cu composites are between 33.7-43.9 %IACS and decreased with the increasing of TiB2 content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity TiB₂/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.