Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

Author

Xiu, Ziyang ; Chen, Guoqin ; Deng, Zongquan ; Gaohui Wu

Author_Institution

Res. Acad. of Sci. & Technol., Harbin Inst. of Technol., Harbin

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

3

Abstract

Sip/1199Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly; The linear CTEs of Sip/1199 composites was between (8.1~12) times 10^-6degC^-1, and they were decreased with the increasing content of Si particles as well as annealing treatment; the thermal conductivity can reach 150 W/ (mmiddotdegC), which was decreased with the increasing contents of Si particles as well as annealing treatment. The composites had excellent mechanical properties and also could be recycled.

Keywords

aluminium; annealing; composite materials; electronics packaging; thermal conductivity; Al; CTE; Sip/1199 composites; annealing treatment; electronic packaging; squeeze-casting technology; thermal conductivity; Aerospace industry; Aerospace materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Materials science and technology; Mechanical factors; Microstructure; Optical microscopy; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607091

Filename

4607091