• DocumentCode
    2687985
  • Title

    Preparation of polysulfoneamide electrospinning nanofibers

  • Author

    Liu, Li ; Shi, Ying ; Jiao, Qinghua ; Wu, Yanan ; Zhang, Zhikun ; Liu, Johan

  • Author_Institution
    Dept. of Polymer Sci., Shanghai Univ., Shanghai
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we select electrospinning technique to fabricate polysulfonamide nanofibers. Polysulfonamide with relatively high inherent viscosity was prepared based on 4,4´-diaminodiphenylsulfone and terephthaloyl chloride in the common solvent N,N-Dimethylacetamide (DMAc) by the method of low-temperature solution condensation polymerization. Our research work focused on studying the effect of concentration of solution, processing parameters including voltage and distance from tip to collector on the spinnability of the solution and morphology electrospun polysulfonamid fibers. The microstructures of the electrospun polysulfonamid fibers were quantitively investigated by scanning electron microscope (SEM) as a function of processing variables.
  • Keywords
    nanostructured materials; nanotechnology; polymer fibres; polymerisation; scanning electron microscopy; viscosity; N-Dimethylacetamide; diaminodiphenylsulfone chloride; low-temperature solution condensation polymerization; morphology electrospun Polysulfonamid fibers; polysulfonamide nanofibers fabrication; polysulfoneamide electrospinning nanofibers; scanning electron microscope; terephthaloyl chloride; Electronics packaging; Electrostatics; Needles; Polyethylene; Polymers; Scanning electron microscopy; Solvents; Spinning; Textile fibers; Voltage; Electrospinning; Nanofibers; Polysulfoneamide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607092
  • Filename
    4607092