Title :
A novel method for simultaneous switching noise analysis in electronic packages
Author :
Zhang, Juyong ; Iyer, Mahadevan K. ; Ooi, Ban Leong ; Leong, Mook Seng
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
Abstract :
In this paper, a novel method is described for simultaneous switching noise (SSN) analysis in a 208 pin plastic quad flat package (PQFP). A two-port S matrix of the pins, and the coupling between the pins are modelled by analytical equations. SSN is analysed as a function of switching drivers and switching time. Numerical results are presented in this paper. The application of Microwave Design System (MDS) and High Frequency Structure Simulator (HFSS) for modelling and simulation of SSN are presented in this paper
Keywords :
S-parameters; circuit simulation; digital integrated circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; numerical analysis; plastic packaging; software tools; switching; High Frequency Structure Simulator; Microwave Design System; PQFP; SSN analysis; analytical equations; electronic packages; modelling; numerical analysis; pin coupling model; plastic quad flat package; silicon digital packaging; simulation; simultaneous switching noise analysis; switching drivers; switching time; two-port S matrix; Circuit simulation; Communication switching; Crosstalk; Electronics packaging; Frequency; Inductance; Matrix converters; Microwave communication; Pins; Voltage;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755985
