DocumentCode :
2688022
Title :
Roadmap of reliability: Methodology and application in Guangdong´s lead-free technology
Author :
Li, Xiaoyan ; Wang, Ling ; Fu, Yonggao ; Zeng, Lu
Author_Institution :
School of Materials Science and Engineering, Beijing University of Technology, 100022, China
fYear :
2008
fDate :
28-31 July 2008
Firstpage :
1
Lastpage :
4
Abstract :
Due to the legislations and environment concerns, the applying of lead free technology is the trend in electronic manufacturing industry. Roadmap of Guangdong’s lead free technology was established within the framework of industrial roadmapping technology. Reliability is one of the most important features in lead free electronic manufacturing. The corresponding roadmap was formulated in accordingly. This paper presents the methodologies which were employed in the roadmapping of reliability aspect in Guangdong’s lead free technology. The employed methodologies include Delphi’s method, Brain Storming method and SWOT analytic method. The roadblocks were estimated and the necessary R&D activities were forecasted finally.
Keywords :
Consumer electronics; Electronics industry; Environmentally friendly manufacturing techniques; Industrial electronics; Lead; Legislation; Manufacturing industries; Materials science and technology; Research and development; Strategic planning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
Type :
conf
DOI :
10.1109/ICEPT.2008.4607095
Filename :
4607095
Link To Document :
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