Title :
EBGA: high frequency electrical characterization and the influence of substrate design parameters on package performance
Author :
Qiu, Youlin ; Iyer, Mahadevan K. ; Chong, Kok Chin ; Zhang, Tong Long ; Rasiah, Ignasius
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
Thermally enhanced ball grid array (EBGA) packages are studied for their electrical performance and the results are reported in this paper. The electrical parasitics of these EBGA packages are extracted in the frequency domain. A performance comparison between EBGA packages considering their different design parameters has been conducted and is reported here. The resonance issues related to the metal heat spreader are also discussed
Keywords :
UHF integrated circuits; ball grid arrays; frequency-domain analysis; heat sinks; integrated circuit design; integrated circuit packaging; integrated circuit testing; resonance; thermal management (packaging); EBGA; EBGA packages; design parameters; electrical parasitics; electrical performance; frequency domain extraction; high frequency electrical characterization; metal heat spreader; package performance; performance comparison; resonance; substrate design parameters; thermally enhanced ball grid array packages; Asia; Assembly; Conducting materials; Copper; Electronic packaging thermal management; Electronics packaging; Frequency; Microelectronics; Resonance; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755987
